tech
Huawei plans new smartphone chips this fall as rivalry with Nvidia and Apple heats up
Chinese telecom giant Huawei announced Monday a new way of designing chips that improves their capabilities, despite U.S. restrictions on the company.
TL;DR
- Huawei announced 'LogicFolding,' a new chip engineering approach for its upcoming Kirin smartphone chips.
- This development occurs as Nvidia faces U.S. export restrictions in China, and Huawei regains market share against Apple.
- Huawei aims for its new technology to deliver capabilities equivalent to 1.4-nanometer process technology by 2031.
- Experts are skeptical about Huawei's claims, citing potential thermal constraints and manufacturing yield issues without access to advanced EUV lithography.
- Huawei's approach expands chip layout from one to two layers, enhancing power efficiency.
- The company is also promoting its 'Law of Tau' ('τ scaling') as a new principle for semiconductor development, challenging the traditional reliance on Moore's Law.